越小越好：小型化射頻- 1部分

　　為了提供全球覆蓋和滿足市場需求，智能手機，平板電腦和其他移動設(shè)備必須支持更多的RF頻段比以往任何時候和功能越來越多的無線功能。盡管事實上，他們的RF電路變得更加復(fù)雜，這些設(shè)備必須保持緊湊，如果不是更緊湊的每一個新的模式。考慮到這一點，設(shè)計師們認識到，更高的頻率的好處之一是，組件可以得到更小。具體而言，天線和電感器可以縮小到表面貼裝和PCB尺寸。集成電路，也可以貢獻，并促成了這一收縮的過程幾何允許完整的RF部分無縫集成的數(shù)字功能與模擬領(lǐng)域的RF調(diào)制，解調(diào)，天線匹配和波傳播。

　　本文著眼于小型化的一些關(guān)鍵組件和系統(tǒng)，將允許設(shè)計師的下一代無線鏈路（您好，物聯(lián)網(wǎng)！）提供更小更高效的無線電和無線電子系統(tǒng)。在這一部分1部分，我們看最新的無源元件，集成幾個離散部分變小，表面貼裝版本，節(jié)省空間和成本，提高性能。

　　These components are useful with modern， highly integrated standard radio link transceiver chips that already offer small-size solutions. Since these established standards are on their third or fourth generation， integrated passives are highly optimized and include miniature front ends， filters， baluns， and other assorted parts that can serve single-standard solutions like Wi-Fi， or multistandard protocols like Wi-Fi Bluetooth combinations.

　　In Part 2， we will look at active components such as RF transistors， mixers， modulators， and amplifiers for next-generation radios. These pieces of a radio may be useful for prototyping and even production of special function radio links that are not highly standardized. Here， SoC-style multichip modules or carrier boards can be used to more accurately preserve impedances and antenna characteristics. It should be noted that if high-volume manufacturing is to take place， more integrated custom silicon may be the best solution to reduce cost and size until the IC makers catch up. Even in this case， the components discussed here will still be useful. All parts， data sheets， tutorials， and development kits referenced here are available online at Digi-Key’s website.