電子發燒友網>電子資料下載>可編程邏輯>EDA-教程>PCB設計規則>表面組裝印制板前期設計的優化

表面組裝印制板前期設計的優化

1320892 2010-11-26 | rar | 1923 | 次下載 | 免費

資料介紹

在影響表面貼裝焊接質量因素中，表面組裝印制板（SMB）的前期設計往往被設計人員所忽視，由此產生的問題通常在大批量生產過程中才會逐漸暴露出來。為此從SMC/SMD元器件、組裝方式、印制板基材的選擇和PCB板的工藝設計規則四個方面進行分析，將工藝要求在設計初期就融入到SMB的設計中去。針對生產中遇到的元器件替換、板材變形、貼片精度以及焊接缺陷等問題，在初期設計就給出了解決方法。同時就初期設計不合理造成的焊接質量缺陷進行討論,分析了其產生的原因，并提出相應的對策。

Abstract:: In many factors which affect the quality of surface mount technology（SMT）, the early design of Surface Mount Board（SMB） is the one which is always ignored. And the influences caused by this factor will be exposed gradually during the process of batch production. This paper analyzed from four parts，the choice of Surface Mount Component（SMC）/ Surface Mount Device（SMD），assembly mode，PCB Base Materials and the design rules of PCB，to integrate the technology requirements into the SMBs early design. Aiming at the problems which existed in the process of production, such as component’s replacement, boards soldering deformation, SMT precision and soldering defects, this paper gave the solution in the early design, and not only discussed the defects of soldering quality which caused by the early defective design, but also proposed the corresponding countermeasures.