隨著電子技術的飛速發(fā)展，高密度、高頻率的電子產(chǎn)品迅猛增長，勢必導致電磁環(huán)境的進一步惡化，從而引起一系列的電磁兼容問題。本文以電磁兼容為主線，以消除各部分電路之間的干擾、降低印制電路板（PCB）的傳導發(fā)射和輻射發(fā)射為目的，對PCB 的抗干擾設計進行了綜合分析確保產(chǎn)品順利通過電磁兼容測試。
關鍵詞: 印制電路板電磁兼容布局 布線 靜電防護
中圖分類號：TN973.3 文獻標識號：A
Electro Magnetic Compatibility Design of Printed Circuit Board
ZHOU Bin1 ZHAO Xiaoyun2
（1、Guilin University of Electronic Technology, Guilin 541004, China）
（2、HENAN XIFEI ELECTRIC CO.,LTD , XinXiang 453002, China）
Abstract: As the fast development of electronic technology, electronic products of high density and high frequency increase rapidly. This will bring on a further deterioration of the electromagnetic environment and cause a series of electromagnetic compatibility problems. To eliminate the interference between every part of circuit and reduce the conductive emission and radiation emission, EMC design of PCB are widely overviewed,which will ensure the products pass the electro magnetic compatibility testing.
Key words: Printed Circuit Board (PCB)；Electromagnetic Compatibility(EMC)；Layout；routing；ESD