TI公司的TDA3x系列是高度優(yōu)化和可升級系統(tǒng)級芯片（SoC），滿足一流的先進駕駛輔助系統(tǒng)要求，具有圖像和視頻加速功能，使性能，低功耗，小型尺寸和ADAS可視分析處理優(yōu)化，便利實現(xiàn)更加自主的和無碰撞駕馭體驗。視頻和圖像處理支持全高清視頻（1920×1080p，60fps），視頻輸入和視頻輸出，具有高達2個C66x浮點VLIW DSP，目標代碼完全和C67x與C64x+兼容，每周期有多達32個16x16位定點乘法，主要應用在單聲道，立體聲或三光前置攝像頭，LVDS或以太網(wǎng)環(huán)繞觀測，以及傳感器融合如可視，雷達，超聲波和激光雷達傳感器。本文介紹了TDA3x系列主要特性，框圖，以及多傳感器平臺ADAS參考設(shè)計TIDEP-01008主要特性，框圖，電路圖，材料清單和PCB設(shè)計圖。
TI’s TDA3x System-on-Chip （SoC） is a highly optimized and scalable family of devices designed to meetthe requirements of leading Advanced Driver Assistance Systems （ADAS）。 The TDA3x family enablesbroad ADAS applications in automobiles by integrating an optimal mix of performance， low power， smallerform factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collisionfree
driving experience.
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling theindustry’s broadest range of ADAS applications including front camera， rear camera， surround view， radar，and fusion on a single architecture.
The TDA3x SoC incorporates a heterogeneous， scalable architecture that includes a mix of TI’s fixed andfloating-point TMS320C66x digital signal processor （DSP） generation cores， Vision AccelerationPac（EVE）， and dual-Cortex-M4 processors. The device allows low power profile in different package options（including Package-On-Package） to enable small form factor designs. TDA3x SoC also integrates a hostof peripherals including multi-camera interfaces （both parallel and serial） for LVDS-based surround viewsystems， displays， CAN and GigB Ethernet AVB.
The Vision AccelerationPac for this family of products includes embedded vision engine （EVE） offloadingthe vision analytics functionality from the application processor while also reducing the power footprint.
The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient programexecution and a vector coprocessor for specialized vision processing.Additionally， Texas Instruments provides a complete set of development tools for the Arm， DSP， and EVEcoprocessor， including C compilers， a DSP assembly optimizer to simplify programming and scheduling，and a debugging interface for visibility into source code execution.The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
TDA3x系列主要特性：
? Architecture Designed for ADAS Applications
? Video and Image Processing Support
– Full-HD Video （1920 × 1080p， 60 fps）
– Video Input and Video Output
? Up to 2 C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x andC64x+
– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle
? Up to 512kB of On-Chip L3 RAM
? Level 3 （L3） and Level 4 （L4） Interconnects
? Memory Interface （EMIF） Module
– Supports DDR3/DDR3L up to DDR-1066
– Supports DDR2 up to DDR-800
– Supports LPDDR2 up to DDR-667
– Up to 2GB Supported
? Dual Arm? Cortex?-M4 Image Processor （IPU）
? Vision AccelerationPac
– Embedded Vision Engine （EVE）
? Display Subsystem
– Display Controller With DMA Engine
– CVIDEO / SD-DAC TV Analog CompositeOutput
? Video Input Port （VIP） Module
– Support for up to 4 Multiplexed Input Ports
? On-chip Temperature Sensor That is Capable ofGenerating Temperature Alerts
? General-Purpose Memory Controller （GPMC）
? Enhanced Direct Memory Access （EDMA）Controller
? 3-Port （2 External） Gigabit Ethernet （GMAC）Switch
? Controller Area Network （DCAN） Module
– CAN 2.0B Protocol
? Modular Controller Area Network （MCAN） Module
– CAN 2.0B Protocol
? Eight 32-Bit General-Purpose Timers
? Three Configurable UART Modules
? Four Multichannel Serial Peripheral Interfaces（McSPI）
? Quad SPI Interface
? Two Inter-Integrated Circuit （I2C） Ports
? Three Multichannel Audio Serial Port （McASP）Modules
? MultiMedia Card/Secure Digital/Secure DigitalInput Output Interface （MMC?/ SD?/SDIO）
? Up to 126 General-Purpose I/O （GPIO） Pins
? Power， Reset， and Clock Management
? On-Chip Debug With CTools Technology
? Automotive AEC-Q100 Qualified
? 15×15mm， 0.65-mm Pitch， 367-Pin PBGA （ABF）
? Seven Dual Clock Comparators （DCC）
? Memory Cyclic Redundancy Check （CRC）
? TESOC （LBIST/PBIST） That Enables Field Testingof Logic and On-Chip Memory
? Error Signaling Module （ESM）
? Five Instances of Real-Time Interrupt （RTI）Modules That Can be Used as Watch Dog Timers
? 8-Channel 10-bit ADC
? MIPI? CSI-2 Camera Serial Interface
? PWMSS
? Full HW Image Pipe： DPC， CFA， 3D-NF， RGBYUV
– WDR， HW LDC and Perspective
TDA3x系列應用：
? Mono， Stereo or Tri-Optic Front Camera
– Object Detection
– Pedestrian Detection
– Traffic Sign Recognition
– Lane Detection and Departure Warning
– Automatic Emergency Braking
– Adaptive Cruise Control
– Forward Collision Warning
– High Beam Assist
? LVDS or Ethernet Surround View
– 2D surround view
– 3D surround view
– Rear object detection
– Parking assist
– Pedestrian Detection
– Lane tracking
– Drive Recording
? Sensor Fusion – Vision， Radar， Ultrasonic， Lidarsensors
– Object data fusion
– Raw data fusion
圖1.TDA3x系列框圖
多傳感器平臺參考設(shè)計
The Multi-Sensor Platform Reference Design for TexasInstruments? Jacinto? TDA3x Advanced DriverAssistance Systems （ADAS） Processors is based onthe DesignCore? TDA3x Starter Kit for ADAS from D3Engineering. This reference design provides qualifieddevelopers all the design material to create a fullyfunctioning evaluation platform for testing anddevelopment of ADAS applications， for use primarily inthe automotive industries and will assist in shorteningdevelopment time of FPD-Link III based vision and sensing systems.
The Multi-Sensor Platform Reference Design for Texas Instruments? Jacinto? TDA3x Advanced DriverAssistance Systems （ADAS） Processors is based on the DesignCore? TDA3x Starter Kit for ADAS fromD3 Engineering. The kits from D3 Engineering are two-part solutions consisting of a processing system onmodule （SOM） and an application-specific baseboard. This reference design is for an application-specificbaseboard. This reference design provides qualified developers all the design material to create a fullyfunctioning evaluation platform for testing and development of ADAS applications， for use primarily in theautomotive industries and will assist in shortening development time of FPD-Link III based vision andsensing systems.
Both the completed baseboard and the TDA3x SOM is contained in the full TDA3x Automotive Starter Kitfrom D3 Engineering. The kit comes ready to use out of the box and includes the processor module，application specific baseboard， power cables， and software. Camera modules， radar modules，displays，calibration tools， and other system components can also be purchased from D3 Engineering to quicklybuild up a system to support many ADAS use cases. The base support package provides optimized andverified hardware and advanced vision software frameworks to use as a known-good launch point fordesign and development. The kit also includes a single-use sublicense for all Texas Instruments? and D3Engineering firmware and application code.Throughout this document， the DesignCore? TDA3x Starter Kit may be referred to simply as the TDA3xsystem or TDA3x module.
多傳感器平臺參考設(shè)計主要特性：
? Compatible with D3 Engineering’s TDA3x SoCProcessor SOM
? 4× FPD-Link III Inputs
? HDMI Input and Output
? USB， CAN Bus， and Serial Connectivity
多傳感器平臺參考設(shè)計應用：
? Surround View Systems （SVS ECU）
? Camera Monitoring Systems （Mirror Replacementand In-Vehicle）
? Satellite Radar Systems （Long， Medium， and ShortRange）
? Sensor Fusion Systems （ADAS Domain Controller）
圖2.多傳感器平臺參考設(shè)計TIDEP-01008外形圖
圖3.多傳感器平臺參考設(shè)計TIDEP-01008框圖
圖4.Micro SD卡插入TDA3x系統(tǒng)圖
圖5.HDMI Mini連接到TDA3x系統(tǒng)HDMI OUT端口圖
圖6.HDMI Mini連接到TDA3x系統(tǒng)HDMI IN端口圖
圖7.TDA3x系統(tǒng)連接到電源圖
圖8.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（1）
圖9.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（2）
圖10.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（3）
圖11.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（4）
圖12.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（5）
圖13.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（6）
圖14.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（7）
圖15.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（8）
圖16.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（9）
圖17.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（10）
圖18.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（11）
圖19.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（12）
圖20.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（13）
圖21.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（14）
圖22.多傳感器平臺參考設(shè)計TIDEP-01008電路圖（15）
多傳感器平臺參考設(shè)計TIDEP-01008材料清單：
圖23.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（1）
圖24.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（2）
圖25.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（3）
圖26.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（4）
圖27.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（5）
圖28.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（6）
圖29.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（7）
圖30.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（8）
圖31.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（9）
圖32.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（10）
圖33.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（11）
圖34.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（12）
圖35.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（13）
圖36.多傳感器平臺參考設(shè)計TIDEP-01008 PCB設(shè)計圖（14）
詳情請見：
和
以及
tidrya8.pdf
tda3.pdf