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活動簡介

作為三星SAFE生態系統的重要合作伙伴之一，芯和半導體將于2023年6月27日-28日參加三星Foundry 論壇及SAFE論壇2023美國站（SFF & SAFE Forum 2023）的活動。

在三星Foundry論壇中, 參與者能獲得三星的遠景規劃及最新的技術創新，并聆聽來自頂級技術專家和行業領袖嘉賓的演講。在三星 SAFE 論壇中, 您還將了解到三星SAFE合作伙伴分享的行業趨勢及在EDA, IP, DSP, 及Packaging領域的挑戰和解決方案，了解高性能計算和汽車領域的先進設計解決方案，并在展館通過與SAFE合作伙伴的討論和合作，拓寬對行業趨勢和創新技術的見解。

技術演示

芯和半導體將在此次大會上帶來多項技術演示，包括：

Metis：先進封裝SI/PI分析

Metis為3DIC Chiplet先進封裝提供了完整的SI/PI/多物理場分析解決方案，支持包括三星I-Cube, H-Cube, R-Cube, X-Cube在內的眾多主流先進封裝工藝。

Metis多尺度能力和容量優勢能支持“裸芯片、中介層和基板“統一的 EM 仿真，突破了借助傳統工具“剪切再縫合”方法帶來的易錯性和局限性。它的多模式分析選項為工程師提供了速度和精確性的選擇，滿足了從架構探索到最終簽核的各個設計環節對仿真效率和精度的不同需求。

Metis在半導體行業國際在線平臺3D InCites的最新評選中勝出，獲封2023“Herb Reiter 年度最佳設計工具供應商獎”稱號。

IRIS：先進工藝制程下的片上無源建模與仿真

芯和半導體射頻設計平臺支持從芯片、封裝、模組到板級的射頻全鏈路設計，包括射頻系統設計工具XDS、片上射頻及高速無源抽取工具IRIS、PDK建模及驗證工具iModeler/iVerifier；IPD包括各種標準和定制集成無源器件及芯片電容等。

IRIS在三星多項先進工藝節點上獲得認證，包括三星8nm LPP FinFET 工藝及28FDS FD-SOI 工藝。憑借加速的3D EM求解器，先進工藝支持以及與Virtuoso的無縫集成，IRIS能幫助RF IC設計人員實現首次設計即能成功的硅上體驗。

大會議程

Samsung Foundry Forum Program:

Date:June 27th, 2023

Time:12:00 - 5:30pm PDT

Venue:Signia by Hilton San Jose, Imperial Ballroom

Address:170 S. Market St., San Jose, CA 95113

Time	R/T(min)	Program
12:00 - 13:00	60’	Networking Lunch & Registration
13:00 - 13:05	5’	Opening(Jinman Han, EVP & Head of DSA Office, Samsung Electronics)
13:05 - 13:20	15’	Samsung Keynote(Siyoung Choi,President,Foundry Business, Samsung Electronics)
13:20 - 13:35	15’	“An Energy Efficient Future of AI”(Joe Macri, SVP, CTO of Computing & Graphics, AMD)
13:35 - 13:50	15’	“Meeting System User Demands in a Slowing Moore’s Law Era” (Chidi Chidambaram, Fellow, Technology and Foundry Engineering, Qualcomm)
13:50 - 14:05	15’	Break
14:05 - 14:35	30’	Process Technology(Gitae Jeong, EVP & Head of Technology Development, Samsung Electronics)
14:35 - 14:50	15’	Manufacturing Excellence (Sang Sup Jeong, EVP & Head of Manufacturing Technology, Samsung Electronics)
14:50 - 15:10	20’	Design Platform (Jongwook Kye, EVP & Head of Design Platform Development, Samsung Electronics)
15:10 - 15:25	15’	Sustainability(Claire Seo, VP, DS Corporate Sustainability Management, Samsung Electronics)
15:25 - 15:40	15’	Break
15:40 - 15:55	15’	“RiscV, AI, and the Next Generation of Compute” (Jim Keller, President & CEO, Tenstorrent)
15:55 - 16:15	20’	Advanced Heterogeneous Integration (Moonsoo Kang, EVP & Head of AVP Business Team, Samsung Electronics)
16:15 - 16:35	20’	Business & Customers (Sang-Pil Sim, EVP & Head of Foundry Worldwide Sales & Marketing, Samsung Electronics)
16:35 - 16:40	5’	Closing (Marco Chisari, EVP & Head of U.S. Foundry and SSIC, Samsung Electronics)
16:40 - 17:30	50’	Partner Pavilion & Networking

SAFEForum Program:

Date:June 28th, 2023

Time:9:00am - 5:30pm PDT

Venue:Signia by Hilton San Jose, Imperial Ballroom & Regency Ballroom 1

Address:170 S. Market St., San Jose, CA 95113

Time	R/T(min)	Program
09:00 - 10:00	60’	Registration
10:00 - 10:05	5’	Opening (Jinman Han, EVP & Head of DSA Office, Samsung Electronics)
10:05 - 10:15	10’	Welcoming Remarks (Jongwook Kye, EVP & Head of Design Platform Development, Samsung Electronics)
10:15 - 10:35	20’	“The 3Ps of 3D-ICs” (Ajei Gopal, President & CEO, Ansys)
10:35 - 10:55	20’	“Unleashing a New Era of Compute with Chiplet-Powered Silicon” (Tony E. Pialis, President & CEO, Alphawave Semi)
10:55 - 11:15	20’	“High-Performance Design in Samsung Foundry” (Leon Stok, VP, IBM)
11:15 - 11:35	20’	Samsung Foundry Process & Business Update (Gibong Jeong, EVP & Head of Business Development, Samsung Electronics)
11:35 - 11:50	15’	Break
11:50 - 12:50	60’	Lunch (Partner Pavilion & Networking)
12:50 - 13:00	10’	Break
13:00 - 16:15	195’	[Tech Session I] Advanced Technology and Design Infrastructure	[Tech Session II] Advanced Design Solutions for HPC and Automotive
Tech Talk: Sangyun Kim, VP & Head of Design Technology, Samsung Electronics Room: Imperial Ballroom Presenter: 8 partner presentations ADT, Ansys, ARM, Cadence, Synopsys	Tech Talk: Jongshin Shin, EVP & Head of IP Ecosystem, Samsung Electronics Room: Regency Ballroom 1 Presenter: 8 partner presentations Alphawave, Cadence, CoAsia, Samsung AVP, SemiFive, Siemens, Synopsys
16:15 - 16:30	15’	Closing	Closing
16:30 - 17:30	60’	Partner Pavilion & Networking