面向電子裝聯的PCB 可制造性設計
烽火通信科技股份有限公司鮮飛
摘 要: 當前電子產品日新月異，要求電路板高密度組裝，安裝方式由表面安裝（SMT）
取代通孔插裝（THT）已是歷史的必然，因此，印制板技術正向高密度、多層化方向飛速發展。而印制板的合理設計是SMT 技術中的關鍵，也是SMT 工藝質量的保證，并有助于提高生產效率。本文就表面安裝PCB 設計時需考慮的一些制造工藝性問題進行了闡述，給PCB 設計人員提供一個參考。
關鍵詞: 印制板；可制造性設計；電子裝聯
DFM of PCB Facing to Electronics Assembly
Xian Fei
(Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China)
Abstract: Nowadays, high-density and multi-layer PCB Technology are developing faster and
faster in order to meet the need of rapid progress of electronic products. So it has become a must o substitute SMT for THT. PCB design is the key of Surface Mount Technology and guarantee f SMT quality, and it can increase efficiency of production.. The paper illustrates some of the oncerns in SMT processing technology on PCB designs，offers a reference for PCB designer.
Keywords: PCB; DFM; Electronics Assembly